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25um BT IC Package Substrate Soft gold plating

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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25um BT IC Package Substrate Soft gold plating

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25um BT IC Package Substrate Soft gold plating

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ...

Product Tags:

1mil BT IC Package Substrate

0.5oz Copper IC Package Substrate

0.25mm Thickness Module Substrate Board

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