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FCCSP package substrate 4L Buildup types ENEPIG

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FCCSP package substrate 4L Buildup types ENEPIG

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FCCSP package substrate 4L Buildup types ENEPIG

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand...

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0.2mm Antenna Circuit Board

Intelligent Handwriting Antenna Circuit Board

Large 0.2mm Antenna PCB

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