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MGC BT Memory substrate 4L with ENEPIG plating

HongRuiXing (Hubei) Electronics Co.,Ltd.
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MGC BT Memory substrate 4L with ENEPIG plating

MGC BT Memory substrate 4L with ENEPIG plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly ...

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